NE Seminars

Friday, March 16, 2007

• Steven Shannon
  Los Alamos National Laboratory
  
• "Multi-Frequency Plasma Discharges for State of the Art Micro and Nano Technology Applications Plasma"
  
• Abstract
  
  Multi-frequency plasma discharges for state of the art micro and nano technology applications plasma assisted materials processing has been a necessary workhorse in microelectronics fabrication for over twenty years. A plasma's ability to provide novel chemisty to the wafer surface, along with the directional supply of energy through ion bombardment, has provided the means for fabrication of novel materials as well as overall device shrinkage due to the advantages of anisotropic processing. Current state of the art plasma processing requires a significant level of control over various plasma parameters, including bulk plasma chemistry, ion flux to the substrate, and ion energy to the substrate. In order to advance plasma science to the next level of micro- and nano- fabrication, several new technologies have been employed. One of these is multi-frequency drive of capacitively coupled discharges. Multifrequency capacitive discharges provide independent control over several plasma parameters, specifically sheat tage and bulk electron density, that provide end user control of the various parameters that will impact materials processing. This talk will present some of the basics of multi-frequency discharges and how these systems are moving plasma processing forward to enable further extension of Moore's Law into the nano-scale.
  

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